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 CEM4532
Jan. 2003
Dual Enhancement Mode Field Effect Transistor ( N and P Channel)
FEATURES
30V , 4.7A , RDS(ON)=55m @VGS=10V. RDS(ON)=85m @VGS=4.5V. -30V , -4.5A , RDS(ON)=80m @VGS=-10V. RDS(ON)=135m @VGS=-4.5V. Super high dense cell design for extremely low RDS(ON). High power and current handing capability. Surface Mount Package.
SO-8 1
1 2 3 4
5
D1
8
D1
7
D2
6
D2
5
S1
G1 S2
G2
ABSOLUTE MAXIMUM RATINGS (TA=25 C unless otherwise noted)
Parameter Drain-Source Voltage Gate-Source Voltage Drain Current-Continuous a -Pulsed Drain-Source Diode Forward Current a Maximum Power Dissipation a Operating Junction and Storage Temperature Range Symbol VDS VGS ID IDM IS PD TJ, TSTG N-Channel P-Channel 30 20 4.7 20 1.7 2.0 -55 to 150 -30 20 4.5 20 -1.7 Unit V V A A A W C
THERMAL CHARACTERISTICS
Thermal Resistance, Junction-to-Ambient a R JA 62.5 C/W
5-7
CEM4532
N-Channel ELECTRICAL CHARACTERISTICS (TA=25 C unless otherwise noted)
Parameter
5
Symbol
BVDSS IDSS IGSS VGS(th) RDS(ON) ID(ON) gFS
c
Condition
VGS = 0V, ID = 250A VDS = 30V, VGS = 0V VGS = 20V, VDS = 0V VDS = VGS, ID = 250A VGS = 10V, ID = 4.7A VGS = 4.5V, ID = 3.7A VDS = 5V, VGS = 10V VDS = 15V, ID = 4.7A
Min Typ C Max Unit
30 1 V A 100 nA 1 40 70 15 5 357 190 60 3 55 85 V m m A S
OFF CHARACTERISTICS
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate-Body Leakage
ON CHARACTERISTICS b
Gate Threshold Voltage Drain-Source On-State Resistance On-State Drain Current Forward Transconductance
DYNAMIC CHARACTERISTICS
Input Capacitance Output Capacitance Reverse Transfer Capacitance
CISS COSS CRSS
c
PF PF PF
VDS =15V, VGS = 0V f =1.0MHZ
SWITCHING CHARACTERISTICS
Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge
tD(ON) tr tD(OFF) tf Qg Qgs Qgd
VDD = 15V, ID = 1A, VGS = 10V, RGEN = 6
15 18 30 5 10.4
30 40 60 15 15
ns ns ns ns nC nC nC
VDS =15V, ID = 4.7A, VGS =10V
5-8
2.3 2.8
CEM4532
P-Channel ELECTRICAL CHARACTERISTICS (TA=25 C unless otherwise noted)
Parameter OFF CHARACTERISTICS
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate-Body Leakage BVDSS IDSS IGSS VGS(th) RDS(ON) ID(ON) gFS
c
Symbol
Condition
VGS = 0V, ID = 250A VDS = -30V, VGS = 0V VGS = 20V, VDS = 0V VDS = VGS, ID = -250A VGS = -10V, ID = -4.5A VGS = -4.5V, ID = -3.6A VDS = -5V, VGS = -10V VDS = -15V, ID = -4.5A
Min Typ C Max Unit
5
-30 -1 V A 100 nA -1 60 105 -15 5.8 448 317 308 -3 80 135 V m m A S
ON CHARACTERISTICS b
Gate Threshold Voltage Drain-Source On-State Resistance On-State Drain Current Forward Transconductance
DYNAMIC CHARACTERISTICS
Input Capacitance Output Capacitance Reverse Transfer Capacitance
CISS COSS CRSS
c
PF PF PF
VDS =-15V, VGS = 0V f =1.0MHZ
SWITCHING CHARACTERISTICS
Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge
tD(ON) tr tD(OFF) tf Qg Qgs Qgd
VDD = -15V, ID = -1A, VGEN = -10V, RGEN = 6
19 19 38 48 18
45 45 75 95 23
ns ns ns ns nC nC nC
VDS =-15V, ID = -4.5A, VGS =-10V
5-9
3 4.5
CEM4532
ELECTRICAL CHARACTERISTICS (TA=25 C unless otherwise noted)
Parameter
5
Diode Forward Voltage
Symbol
VSD
Condition
VGS = 0V, Is = 1.7A N-Ch VGS = 0V, Is =-1.7A P-Ch
Min Typ Max Unit
0.8 -0.8 1.2 -1.2
C
DRAIN-SOURCE DIODE CHARACTERISTICS b
V Notes a.Surface Mounted on FR4 Board, t 10sec. b.Pulse Test:Pulse Width 300 s, Duty Cycle 2%. c.Guaranteed by design, not subject to production testing.
N-Channel
20
VGS=10,9,8,7,6V
20 VGS=5V 25 C VGS=4V 16
16
ID, Drain Current (A)
12
ID, Drain Current (A)
12
8
8 -55 C 4 0 Tj=125 C
4
VGS=3V
0 0 0.5 1.0 1.5 2.0 2.5 3.0
1
2
3
4
5
VDS, Drain-to-Source Voltage (V)
VGS, Gate-to-Source Voltage (V)
Figure 1. Output Characteristics
RDS(ON), Normalized RDS(ON), On-Resistance(Ohms)
600 500
Figure 2. Transfer Characteristics
1.80 1.60 1.40 1.20 1.00 0.80 0.60 -50 -25 0 25 50 75 100 125 150
ID=4.7A VGS=10V
C, Capacitance (pF)
400 300
Ciss
Coss 200 100 0 0 5 10 15 20 25 30 Crss
VDS, Drain-to Source Voltage (V)
TJ, Junction Temperature( C)
Figure 3. Capacitance
Figure 4. On-Resistance Variation with Temperature
5-10
CEM4532
BVDSS, Normalized Drain-Source Breakdown Voltage Vth, Normalized Gate-Source Threshold Voltage
1.30 1.20 1.10 1.00 0.90 0.80 0.70 0.60 -50 -25 0 25 50 75 100 125 150 VDS=VGS ID=250 A 1.15 ID=250 A 1.10 1.05 1.00 0.95 0.90 0.85 -50 -25
5
0
25
50
75 100 125 150
Tj, Junction Temperature ( C)
Tj, Junction Temperature ( C)
Figure 5. Gate Threshold Variation with Temperature
20
Figure 6. Breakdown Voltage Variation with Temperature
20 10 VGS=0V
gFS, Transconductance (S)
12
Is, Source-drain current (A)
20
16
8 4 VDS=15V 0 0 5 10 15
1
0.1 0.4 0.6 0.8 1.0 1.2
IDS, Drain-Source Current (A)
VSD, Body Diode Forward Voltage (V)
Figure 7. Transconductance Variation with Drain Current
10
VGS, Gate to Source Voltage (V)
Figure 8. Body Diode Forward Voltage Variation with Source Current
8 6 4 2 0 0
ID, Drain Current (A)
VDS=15V ID=4.7A
10 1
RD
S(
ON
)L
im
it
1m
10
s
10
1s DC 10 s
ms
0m
s
10 0
10 -1
-2
10
TA=25 C Tj=150 C Single Pulse 10 1 10 0 10
1
3
6
9
12
10 -1
Qg, Total Gate Charge (nC)
VDS, Drain-Source Voltage (V)
Figure 9. Gate Charge 5-11
Figure 10. Maximum Safe Operating Area
CEM4532
P-Channel
-ID, Drain Current (A)
20
-VGS=10 thru 5V
20 25 C 16
16
12 -VGS=4V 8
-ID, Drain Current (A)
12
5
8 -55 C 4 0 Tj=125 C
4
-VGS=3V
0 0 1 2 3 4 5 6
0
2
4
6
8
-VDS, Drain-to-Source Voltage (V)
-VGS, Gate-to-Source Voltage (V)
Figure 11. Output Characteristics
Figure 12. Transfer Characteristics
RDS(ON), On-Resistance(Ohms)
600 500 Ciss
1.80 1.60 1.40 1.20 1.00 0.80 0.60 -50 -25 0 25 50 75 100 125 150
ID=-4.5A VGS=-10V
C, Capacitance (pF)
400 Coss 300 Crss 200 100 0 0 5 10 15 20 25 30
-VDS, Drain-to Source Voltage (V)
TJ, Junction Temperature( C)
Figure 13. Capacitance
Figure 14. On-Resistance Variation with Temperature
1.15 ID=-250 A 1.10 1.05 1.00 0.95 0.90 0.85 -50 -25
1.20 1.10 1.00 0.90 0.80 0.70 0.60 -50 -25 0 25 50
VDS=VGS ID=-250 A
BVDSS, Normalized Drain-Source Breakdown Voltage
Vth, Normalized Gate-Source Threshold Voltage
1.30
75 100 125 150
0
25
50
75 100 125 150
Tj, Junction Temperature ( C)
Tj, Junction Temperature ( C)
Figure 15. Gate Threshold Variation with Temperature 5-12
Figure 16. Breakdown Voltage Variation with Temperature
CEM4532
P-Channel
20 1.15 20 10 VGS=0V 1.10 ID=250 A 1.05 1.00 1 0.95 0.90 0.1 0.85 0 5 10 15 20 0.4 -25 0 25 0.6 50 75 100 125 150 1.2 1.0 0.8
5
gFS, Transconductance (S)
12 8 4 VDS=-15V 0
-Is, Source-drain current (A)
16
-IDS, Drain-Source Current (A)
-VSD, Body Diode Forward Voltage (V)
Figure 17. Transconductance Variation with Drain Current
Figure 18. Body Diode Forward Voltage Variation with Source Current
10
VGS, Gate to Source Voltage (V) -ID, Drain Current (A)
8 6 4 2 0 0
VDS=-15V ID=-4.5A
10 1
RD O S(
N)
Lim
it
1m
s
10
m
10
10
DC
1s
s
0m
s
10
0
s
10 -1
-2
10
TA=25 C Tj=150 C Single Pulse 10 1 10 0 10
1
5
10
15
20
10 -1
Qg, Total Gate Charge (nC)
-VDS, Drain-Source Voltage (V)
Figure 19. Gate Charge
Figure 20. Maximum Safe Operating Area
5-13
CEM4532
VDD t on toff tr
90%
5
VGS RGEN
V IN D G
RL VOUT
td(on) VOUT
td(off)
90% 10%
tf
10%
INVERTED
90%
S
VIN
50% 10%
50%
PULSE WIDTH
Figure 21. Switching Test Circuit
Figure 22. Switching Waveforms
10 2
0
r(t),Normalized Effective Transient Thermal Impedance
1
D=0.5 Duty Cycle=0.5 0.2
10
-1
0.1 0.2 0.05
0.1 10
-2
0.1 0.02 0.05 0.01 0.02 Single Pulse Single Pulse
PDM t1
PDM t2 t1 t2
1. R JA (t)=r (t) *JA (t)=r (t) * R JA 1. R R JA 2. R JA=See R JA=See Datasheet 2. Datasheet P* R JA (t) 3. TJM-TA =3. TJM-TA = PDM* R JA (t) 4. Duty Cycle, D=t1/t2 D=t1/t2 4. Duty Cycle, 10 10
-2 -2
0.01 10
-3
10
-4
10 10
-3-3
10
-1
10
-1
10
0
1
10
1
10
10
2
100
Square Wave Pulse Duration (sec)
Figure 13. Normalized Thermal Transient Impedance Curve 23.
5-14


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